TransPak to unveil major expansion of its Global Design Center, reinforcing its commitment to packaging and testing solutions for evolving data center infrastructure.
San Jose, Calif., April 10, 2025 – TransPak, a global leader in integrated logistics and engineered packaging solutions, will participate as an exhibitor at Data Center World 2025, the leading global conference for data center IT infrastructure, mission-critical facilities management, new power designs and solutions, emerging construction practices, and the innovative tools and technologies needed to become an AI factory, in booth #995. The event takes place April 14-17, 2025, in Washington, D.C.
As data center infrastructure expands and server racks grow larger and heavier, the demand for advanced packaging solutions and testing has never been greater. TransPak is meeting this challenge head-on. With over 200,000 integrated racks shipped annually, the company remains ahead of the curve by proactively investing in the infrastructure, testing capabilities, and engineering needed to support next-gen data center demands.
Unveiling at Booth #995: Expansion Plans for TransPak’s Global Design Center
At this year’s show, TransPak will officially unveil plans for a major expansion of its Hayward-based Global Design Center. The upcoming revitalization includes:
- 5,000+ sq. ft. of upgraded lab space, supported by a 10-ton overhead crane for handling large, heavy payloads
- Newly enhanced vibration, compression, impact, drop, and horizontal load stability systems, all engineered for products up to 15,000 lbs.
- A walk-in environmental conditioning chamber to simulate extreme conditions for large crated systems
- Dedicated customer work and storage areas for hands-on testing, development, and secure material staging
“At TransPak, we’re not just keeping up with industry changes; we’re anticipating them,” said Zachary Curliano, Business Development Manager, TransPak. “As data centers scale in complexity, we’re investing in the technology, expertise, and infrastructure to provide unparalleled packaging, logistics, and testing solutions that optimize performance, sustainability, and security.”
Data Center World is the longest-running data center conference, blending decades of experience with insight into current and future strategic issues. It offers four days of education through in-depth workshops, conference sessions and keynotes from industry luminaries, the largest offering of data center technology solutions in the exhibit hall and unlimited networking opportunities.
About TransPak
Headquartered in Silicon Valley, TransPak has been providing innovative and cost-effective design, crating, packaging and global logistics for over 70 years. As a customer-obsessed, women- and family-owned company, TransPak combines the agility of a small business with the reliability of a global powerhouse. TransPak lives by the slogan, “We make it happen,” ensuring that high-value, fragile, and oversized goods reach their destinations safely and efficiently. Learn more at www.transpak.com.
About Data Center World
Data Center World is the global conference for data center facilities and IT professionals. It offers premier education, abundant networking, and the broadest access to best-in-class vendors. Designed to help data center and IT infrastructure professionals with challenging issues, Data Center World presents top-quality knowledge without bias towards a specific vendor product or service. CIO Dive named Data Center World one of the top technology conferences to attend in 2024 for the second consecutive year. Data Center World 2025 will be held April 14-17 in Washington, D.C. Data Center World is produced by Informa PLC. Building on the success of Data Center World U.S., the inaugural Data Center Asia, taking place July 15-17, 2025, in Hong Kong, will serve as the epicenter for data center technology innovations and business transformations in the fast-growing Asia-Pacific markets. Click here for more information on Data Center World or follow on X, LinkedIn, YouTube and Facebook.
